Description: Duties Develop experiments to investigate wafer direct bonding bond strength Prepare chips and wafers for experimental investigation of chip-to-chip and chip-to-wafer direct bonding, including dicing, cleaning, patterning, etching, and ...
8 days ago
... and complex assignments in engineering research discipline, with limited supervision, towards ... the state-of-art of research in AM in-situ measurements ... colleagues on development of new research and experiment planning. The incumbent ...
5 days ago