Description:
Piper Companies is seeking a Principal Packaging Engineer who will develop and refine Chip-on-Wafer-on-Substrate technology. The Packaging engineer will be preferred in office in Saratoga, CA, but is open to remote. Requirements for the Packaging Engineer include: - Innovate and enhance CoWoS packaging processes to boost chip performance, power efficiency, and reliability. - Collaborate with design, test, and manufacturing teams to ensure flawless chip-package integration. - Lead failure analys
May 2, 2025;
from:
dice.com